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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated SMALL OUTLINE PACKAGE
The MPX5010/MPXV5010G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * 5.0% Maximum Error over 0 to 85C * Ideally Suited for Microprocessor or Microcontroller- Based Systems * Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package * Temperature Compensated over *40 to +125C * Patented Silicon Shear Stress Strain Gauge * Available in Differential and Gauge Configurations * Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples * Hospital Beds * HVAC * Respiratory Systems * Process Control
MPXV5010GP CASE 1369 MPXV5010GC7U CASE 482C MPXV5010GC6U CASE 482A
MPX5010 MPXV5010G SERIES
Motorola Preferred Device
INTEGRATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) 0.2 to 4.7 V Output
MPXV5010G6U CASE 482 UNIBODY PACKAGE
MPX5010D CASE 867
MPX5010DP CASE 867C
VS
SENSING ELEMENT
THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1
GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
Vout
MPXV5010DP CASE 1351
MPX5010GS CASE 867E
PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS FOR SURFACE MOUNT PACKAGE GND PINS 4, 5, AND 6 ARE NO CONNECTS FOR UNIBODY PACKAGE
PIN NUMBER
1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C 1 2 3
PIN NUMBER
Vout Gnd VS 4 5 6 N/C N/C N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. REV 9
NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Motorola Sensor (c) Motorola, Inc. 2002 Device Data
1
MPX5010 MPXV5010G SERIES
MAXIMUM RATINGS(NOTE)
Parametrics Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 75 -40 to +125 -40 to +125 Unit kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3
required to meet specification.) Characteristic Pressure Range(1) Symbol POP VS Io Offset(3) (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR IO+ -- -- Min 0 4.75 -- 0 4.475 4.275 -- -- -- -- -- -- Typ -- 5.0 5.0 0.2 4.7 4.5 -- 450 1.0 0.1 20 0.5 Max 10 5.25 10 0.425 4.925 4.725 5.0 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
Supply Voltage(2) Supply Current Minimum Pressure @ VS = 5.0 Volts
Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Offset Time(8)
Stability(9)
NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MECHANICAL CHARACTERISTICS
Characteristics Weight, Basic Element (Case 867) Weight, Basic Element (Case 482) Typ 4.0 1.5 Unit grams grams
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Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5010 and MPXV5010G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.
FLUOROSILICONE GEL DIE COAT P1 WIRE BOND
DIE
STAINLESS STEEL CAP
+5 V
Vout OUTPUT
THERMOPLASTIC CASE 1.0 mF 0.01 mF
Vs IPS GND 470 pF
LEAD FRAME
P2 DIFFERENTIAL SENSING ELEMENT DIE BOND
Figure 2. Cross-Sectional Diagram SOP (Not to Scale)
Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646.
5.0
OUTPUT (V)
TRANSFER FUNCTION: 4.5 V = V *(0.09*P+0.04) ERROR out S 4.0 VS = 5.0 Vdc TEMP = 0 to 85C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 7 4 5 6 8 DIFFERENTIAL PRESSURE (kPa) 9 10 11 MAX MIN TYPICAL
Figure 4. Output versus Pressure Differential
Motorola Sensor Device Data
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MPX5010 MPXV5010G SERIES Transfer Function (MPX5010, MPXV5010G)
Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) Nominal Transfer Value: (Pressure Error x Temp. Factor x 0.09 x VS) Nominal Transfer Value: VS = 5.0 V 0.25 Vdc
Temperature Error Band
MPX5010, MPXV5010G Series
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 Temp - 40 0 to 85 +125 Multiplier 3 1 3
-40
-20
0
20
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
0.5 0.4 0.3 Pressure Error (kPa) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 Pressure 0 to 10 kPa Error (Max) 0.5 kPa 0 1 2 3 4 5 6 7 8 9 10 Pressure (kPa)
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Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX
Part Number MPX5010D MPX5010DP MPX5010GP MPX5010GS MPX5010GSX MPXV5010G6U MPXV5010G7U MPXV5010GC6U/T1 MPXV5010GC7U MPXV5010GP MPXV5010DP Case Type 867C 867C 867B 867E 867F 482 482B 482A 482C 1369 1351 Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Stainless Steel Cap Stainless Steel Cap Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier
ORDERING INFORMATION -- UNIBODY PACKAGE (MPX5010 SERIES)
MPX Series Device Type Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge, Axial Gauge, Axial PC Mount Options Case Type 867 867C 867B 867E 867F Order Number MPX5010D MPX5010DP MPX5010GP MPX5010GS MPX5010GSX Device Marking MPX5010D MPX5010DP MPX5010GP MPX5010D MPX5010D
ORDERING INFORMATION -- SMALL OUTLINE PACKAGE (MPXV5010G SERIES)
Device Type Basic Elements Options Gauge, Element Only, SMT Gauge, Element Only, DIP Ported Elements Gauge, Axial Port, SMT Gauge, Axial Port, DIP Gauge, Axial Port, SMT Gauge, Side Port, SMT Differential, Dual Port, SMT Case No. 482 482B 482A 482C 482A 1369 1351 MPX Series Order No. MPXV5010G6U MPXV5010G7U MPXV5010GC6U MPXV5010GC7U MPXV5010GC6T1 MPXV5010GP MPXV5010DP Packing Options Rails Rails Rails Rails Tape and Reel Trays Trays Marking MPXV5010G MPXV5010G MPXV5010G MPXV5010G MPXV5010G MPXV5010G MPXV5010G
Motorola Sensor Device Data
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MPX5010 MPXV5010G SERIES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
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Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41
S
N C H -T- K M
PIN 1 IDENTIFIER SEATING PLANE
J
CASE 482-01 ISSUE O
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A
Motorola Sensor Device Data
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MPX5010 MPXV5010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS--CONTINUED
-A-
5 4
N -B-
8
G
1
0.25 (0.010)
M
TB
D 8 PL SA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17
DETAIL X S W
V C
PIN 1 IDENTIFIER
-T- K M J DETAIL X
CASE 482C-03 ISSUE B
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Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS--CONTINUED
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7
T
N K
A
8X
M
P
0.004 (0.1)
SEATING PLANE
DETAIL G C
CASE 1369-01 ISSUE O
Motorola Sensor Device Data
9
MPX5010 MPXV5010G SERIES SMALL OUTLINE PACKAGE DIMENSIONS--CONTINUED
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
DETAIL G C
K
CASE 1351-01 ISSUE O
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Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES UNIBODY PACKAGE DIMENSIONS
C R M B -A- N
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. 12. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66
L
-T- G F D 6 PL 0.136 (0.005)
M
J S
TA
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N
BASIC ELEMENT
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)
M
TQ
M
-A- U W L V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
PORT #2 VACUUM (P2)
N
PORT #1 POSITIVE PRESSURE (P1)
-Q- B
PIN 1
1
2
3
4
5
6
K S
C
SEATING PLANE
-T-
-T- J
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
CASE 867C-05 ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
VOUT GROUND VCC V1 V2 VEX
Motorola Sensor Device Data
11
MPX5010 MPXV5010G SERIES UNIBODY PACKAGE DIMENSIONS--CONTINUED
C
A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93
-B-
V
PIN 1
PORT #1 POSITIVE PRESSURE (P1)
6
5
4
3
2
1
K
S G F D
6 PL M
J N E -T-
0.13 (0.005)
TB
M
VOUT GROUND VCC V1 V2 VEX
CASE 867E-03 ISSUE D
PRESSURE SIDE PORTED (AS, GS)
12
Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES
NOTES
Motorola Sensor Device Data
13
MPX5010 MPXV5010G SERIES
NOTES
14
Motorola Sensor Device Data
MPX5010 MPXV5010G SERIES
NOTES
Motorola Sensor Device Data
15
MPX5010 MPXV5010G SERIES
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/
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Motorola Sensor Device Data
MPX5010/D

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